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Visit us at Embedded World 2022
Monday 30 May 2022

Come and see Think Silicon’s exciting and cutting-edge GPU, Display, Vision, and Software innovations for MCU and MPU-driven SoCs at Embedded World in Nuremberg/Germany. Book a meeting now to visit the Think Silicon® booth 4-478, hall 4 from June 21st till June 23rd in Nuremberg, Germany. Meeting request: info(at)think-silicon.com

By visiting Think Silicon’s booth, you’ll have the opportunity to view the industry’s first RISC-V® ISA-based GPU -- the NEOXTM G-Series & A-Series. Think Silicon will also exhibit NEMA®|pico-VG the latest addition of the NEMA®| GPU-Series, with significant hardware and software upgrades supporting rich vector graphic features that help to offload CPU utilization by 95%.

NEOX™ G-Series & A-Series – A New Era of Smart GPU Architectures

Offering a myriad of flexible possibilities, NEOX™| G (graphics) & A (deep learning accelerator) Series IP represents a new era of smart GPU architectures with programable compute shaders running on a real-time operating system (RTOS), and supported by light-weight graphics and machine learning programming frameworks. The heavily multi-threaded system and its individual configurable programming libraries use the same hardware blocks and can be extended with customized extensions by combining graphics, machine learning, vision/video processing and general-purpose compute workloads. The new offering serves as a GPU platform to be implemented in 32-bit SoCs addressing a wide variety of vertical markets including next-generation ultra-low-power smartwatches, augmented reality (AR) eyewear, surveillance, and entertainment video, and smart displays for point-of-sale/point-of-interaction terminals. NEOX™ IP pre-evaluation systems are now available for customer testing and Think Silicon will be demonstrating 3D/2D graphics and machine learning applications at Embedded World.

NEMA®|pico-VG – High-Performance Graphics for Power-, Size- and Cost-Constrained Products

Think Silicon’s new NEMA®|pico-VG multi-core, vector, and 2.5D raster graphics GPU, supports clock frequencies from 90-500MHz, 70 fps, and 800x600 resolution in a tiny silicon area of 0.21mm2. The NEMA®|pico-VG is the latest addition of high-performance and ultra-low-power graphics for displays in battery-driven, power-constrained products. Combining hardware-accelerated vector and raster graphics in a single IP solution gives developers the freedom and flexibility to choose the best rendering technique based on the graphics content being displayed. The NEMA®| pico-VG uses smart compression algorithms to efficiently manage the valuable memory space, thereby reducing the CPU utilization by up to 95% compared to software-only solutions. The combination of RTL hardware blocks and software makes the NEMA®|pico-VG the ideal high-performance graphics sub-system in power-, size-, and cost-constrained products such as smartwatches, health, and GPS trackers, and smart home devices such as thermostats and smart speakers. The NEMA®|pico-VG production-ready RTL is expected to begin shipping to customers in Q4 2022.


Also featured at the event will be Think Silicon’s NEMA®|GUI-Builder, a fast and easy-to-learn tool that enables programmers to significantly reduce GUI development time on SoC platforms (MCU/MPU) by using drag-and-drop common control and input elements on the GUI surface from a large set of library widgets. NEMA®|GUI-Builder automatically produces power and performance-optimized C code with a small memory footprint by utilizing the powerful 3D features of the NEMA®|GPU-Series. NEMA®|GUI-Builder includes Think Silicon’s NEMA®|GFX software API and its highly efficient compression technology NEMA®|TSC™, which can also be used on SoC platforms with non-Think Silicon GPUs.

Should you wish to arrange an appointment with us, please send us your requests to info(at)think-silicon.com. We are looking forward to meeting you.

Embedded World attracts more than 30,000 attendees and more than 1,000 exhibitors, offering the embedded community the opportunity to see the latest innovations in embedded technologies. While you’re at the event, be sure to stop by the Think Silicon booth so as to explore our proven methods and solutions aimed at ultra-low power-connected wearables and low-power embedded applications. Also, you will have the chance to get informed about the current TETRAMAX open calls supporting digitization in Europe in customized low energy computing.
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